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Journal description
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Details for article 18 of 20 found articles
| Title: |
Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics |
| Author: |
Mazullah, Sadiq, Muhammad Khan, Maaz Mateen, Abdul Shahzad, Muhammad Akhtar, Kareem Khan, Jawad |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 122 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 20 found articles
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