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Journal description
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Details for article 8 of 16 found articles
| Title: |
Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process |
| Author: |
Hwang, Yeon-Taek Um, Hui-Jin Yu, Myeong-Hyeon Lee, Dae-Woong Lee, Mi-Jung Kim, Hak-Sung |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 121 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 16 found articles
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