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Details for article 5 of 22 found articles
| Title: |
A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions |
| Author: |
Yang, Hung-Chun Chiu, Tz-Cheng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 119 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 22 found articles
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