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Journal description
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Details for article 2 of 21 found articles
| Title: |
A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects |
| Author: |
Kim, Cheol Son, Kirak Kim, Gahui Kim, Sungtae Lee, Sol-Kyu Lee, So-Yeon Park, Young-Bae Joo, Young-Chang |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 116 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 21 found articles
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