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                                       Details for article 5 of 14 found articles
 
 
  Base solder voids identification of IGBT modules using case temperature
 
 
Title: Base solder voids identification of IGBT modules using case temperature
Author: Fan, Yuhui
Cui, Haoyang
Lou, Zhibin
Teng, Jiajie
Tang, Zhong
Peng, Jianzhong
Appeared in: Microelectronics reliability
Paging: Volume 115 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 14 found articles
 
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