|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 53 of 175 found articles
| Title: |
Damage based PoF model of solder joints under temperature cycling and electric coupling condition |
| Author: |
Yuan, Jiaxin Zhang, Sujuan Wan, Bo Fu, Guicui Jiang, Maogong |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 114 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 53 of 175 found articles
| << previous | next >> |