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Journal description
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Details for article 25 of 175 found articles
| Title: |
A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms |
| Author: |
Li, Yaqiu Pan, Guangze Li, Qian Wang, Chunhui Hu, Xianghong |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 114 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 175 found articles
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