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Journal description
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Details for article 3 of 14 found articles
| Title: |
Bending reliability of Ni–MWCNT composite solder with a differential structure |
| Author: |
Lee, Choong-Jae Hwang, Byeong-Uk Min, Kyung Deuk Kim, Jae-Ha Jung, Seung-Boo |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 113 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 14 found articles
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