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                                       Details for article 14 of 14 found articles
 
 
  The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
 
 
Title: The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering
Author: Liu, Zhi-Quan
Meng, Zhi-Chao
Wu, Di
Shang, Zhengang
He, Xin
Xiong, Xiaodong
Appeared in: Microelectronics reliability
Paging: Volume 113 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 14 of 14 found articles
 
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