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                                       Details for article 7 of 12 found articles
 
 
  Impact of back-end-of-line architecture on chip-package-interaction in advanced interconnects
 
 
Title: Impact of back-end-of-line architecture on chip-package-interaction in advanced interconnects
Author: Vanstreels, Kris
Zahedmanesh, Houman
Gonzalez, Mario
Appeared in: Microelectronics reliability
Paging: Volume 112 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 12 found articles
 
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