|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 15 of 22 found articles
| Title: |
Modelling stress evolution and voiding in advanced copper nano-interconnects under thermal gradients |
| Author: |
Zahedmanesh, Houman Croes, Kristof |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 111 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 22 found articles
| << previous | next >> |