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                                       Details for article 11 of 22 found articles
 
 
  FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
 
 
Title: FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Author: Grams, Arian
Jaeschke, Johannes
Wittler, Olaf
Fabian, Benjamin
Thomas, Sven
Schneider-Ramelow, Martin
Appeared in: Microelectronics reliability
Paging: Volume 111 () nr. C pages p.
Year: 2020
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 11 of 22 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands