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Journal description
All volumes of the corresponding journal
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Details for article 11 of 24 found articles
| Title: |
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions |
| Author: |
Dele-Afolabi, T.T. Hanim, M.A. Azmah Calin, R. Ilyas, R.A. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 110 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 24 found articles
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