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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 7 of 118 found articles
| Title: |
A new gold-tin alloy composition for hermetic package sealing and attachment of hybrid parts |
| Author: | |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 11 (1972) nr. 5 pages 1 p. |
| Year: |
1972 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 118 found articles
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