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Journal description
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Details for article 5 of 25 found articles
| Title: |
Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints |
| Author: |
Kong, Xiangxia Zhai, Junjun Sun, Fenglian Liu, Yang Zhang, Hao |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 107 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 25 found articles
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