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Journal description
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Details for article 15 of 25 found articles
| Title: |
Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory |
| Author: |
Zhipeng, Zhao Xiaomin, Zhang Shulin, Tan Zhouzhi, Wu Hengjia, Zhang |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 107 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 25 found articles
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