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Journal description
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Details for article 8 of 25 found articles
| Title: |
Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking |
| Author: |
Panchenko, Iuliana Wolter, Klaus-Juergen Croes, Kristof De Wolf, Ingrid De Messemaeker, Joke Beyne, Eric Wolf, M. Juergen |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 102 (2019) nr. C pages p. |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 25 found articles
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