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                                       Details for article 20 of 25 found articles
 
 
  Reliability analysis of tape based chip-scale packages based metamodel
 
 
Title: Reliability analysis of tape based chip-scale packages based metamodel
Author: Hamdani, Hamid
El Hami, Abdelkhalak
Radi, Bouchaïb
Appeared in: Microelectronics reliability
Paging: Volume 102 (2019) nr. C pages p.
Year: 2019
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 20 of 25 found articles
 
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