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Journal description
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Details for article 511 of 2989 found articles
| Title: |
Characterization on acceleration-factor equation for packaging-solder joint reliability |
| Author: |
Wu, K.-C. Chiang, K.-N. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 65 (2016) nr. C pages 6 p. |
| Year: |
2016 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 511 of 2989 found articles
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