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Journal description
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Details for article 505 of 2989 found articles
| Title: |
Characterization of plastic and creep behavior in thick aluminum wire for power modules |
| Author: |
Shishido, Nobuyuki Setoguchi, Yoshiki Kumagai, Yuto Koganemaru, Masaaki Ikeda, Toru Hayama, Yutaka Miyazaki, Noriyuki |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 123 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 505 of 2989 found articles
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