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Journal description
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Details for article 212 of 3017 found articles
| Title: |
Analytical modeling of thermo-mechanical stress for bond wire of IGBT module |
| Author: |
Dai, Xingyu Yang, Xin Wu, Xinlong Tu, Chunming Liu, Guoyou |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 127 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 212 of 3017 found articles
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