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Journal description
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Details for article 168 of 3017 found articles
| Title: |
Analysis of extensive wetting angle vs. cooling rate data in Bi-, Zn- and Sn-based solder alloys |
| Author: |
Silva, Bismarck Luiz Gouveia, Guilherme Lisboa Cheung, Noé Garcia, Amauri Spinelli, José Eduardo |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 135 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 168 of 3017 found articles
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