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                                       Details for article 942 of 1093 found articles
 
 
  Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures
 
 
Title: Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures
Author: Dalleau, David
Weide-Zaage, Kirsten
Danto, Yves
Appeared in: Microelectronics reliability
Paging: Volume 43 (2003) nr. 9-11 pages 6 p.
Year: 2003
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 942 of 1093 found articles
 
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