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                                       Details for article 375 of 1093 found articles
 
 
  Electromigration in width transition copper interconnect
 
 
Title: Electromigration in width transition copper interconnect
Author: Roy, Arijit
Hou, Yuejin
Tan, Cher Ming
Appeared in: Microelectronics reliability
Paging: Volume 49 (2009) nr. 9-11 pages 4 p.
Year: 2009
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 375 of 1093 found articles
 
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