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Journal description
All volumes of the corresponding journal
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Details for article 198 of 551 found articles
| Title: |
Evaluating board level solder interconnects reliability using vibration test methods |
| Author: |
Liu, Y. Sun, F.L. Zhang, H.W. Wang, J. Zhou, Z. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 9-10 pages 5 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 198 of 551 found articles
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