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Journal description
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Details for article 112 of 551 found articles
| Title: |
Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests |
| Author: |
Mavinkurve, A. Goumans, L. O’Halloran, G.M. Rongen, R.T.H. Farrugia, M.-L. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 9-10 pages 5 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 112 of 551 found articles
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