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Journal description
All volumes of the corresponding journal
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Details for article 502 of 572 found articles
| Title: |
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull |
| Author: |
Zaal, J.J.M. Hochstenbach, H.P. van Driel, W.D. Zhang, G.Q. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 49 (2009) nr. 8 pages 7 p. |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 502 of 572 found articles
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