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Journal description
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Details for article 368 of 572 found articles
| Title: |
No-flow underfill flip chip assembly––an experimental and modeling analysis |
| Author: |
Lu, H Hung, K.C Stoyanov, S Bailey, C Chan, Y.C |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 42 (2002) nr. 8 pages 8 p. |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 368 of 572 found articles
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