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Journal description
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Details for article 347 of 572 found articles
| Title: |
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads |
| Author: |
Ratchev, Petar Stoukatch, Serguei Swinnen, Bart |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 8 pages 11 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 347 of 572 found articles
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