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Journal description
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Details for article 323 of 572 found articles
| Title: |
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes |
| Author: |
Liu, Yang Sun, Fenglian Zhang, Hao Xin, Tong Yuan, Cadmus A. Zhang, Guoqi |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 8 pages 7 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 323 of 572 found articles
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