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Journal description
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Details for article 122 of 572 found articles
| Title: |
Characterization of flip chip bonded structure with Cu ABL power bumps |
| Author: |
Ma, Junsung Kim, Sungdong Kim, Sarah Eunkyung |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 8 pages 5 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 122 of 572 found articles
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