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Vertical die crack stresses of Flip Chip induced in major package assembly processes |
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Title: |
Vertical die crack stresses of Flip Chip induced in major package assembly processes |
Author: |
Yang, D.G. Ernst, L.J. van `t Hof, C. Kiasat, M.S. Bisschop, J. Janssen, J. Kuper, F. Liang, Z.N. Schravendeel, R. Zhang, G.Q. |
Appeared in: |
Microelectronics reliability |
Paging: |
Volume 40 (2000) nr. 8-10 pages 6 p. |
Year: |
2000 |
Contents: |
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Publisher: |
Published by Elsevier B.V. |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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