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Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package |
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Titel: |
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package |
Auteur: |
Ong, Yue Ying Ho, Soon Wee Vaidyanathan, Kripesh Sekhar, Vasarla Nagendra Jong, Ming Chinq Yak Long, Samuel Lim Wen Sheng, Vincent Lee Wai, Leong Ching Rao, Vempati Srinivasa Ong, Jimmy Ong, Xuefen Zhang, Xiaowu Seung, Yoon Uk Lau, John H. Lim, Yeow Kheng Yeo, David Chan, Kai Chong Yanfeng, Zhang Tan, Juan Boon Sohn, Dong Kyun |
Verschenen in: |
Microelectronics reliability |
Paginering: |
Jaargang 50 (2010) nr. 7 pagina's 9 p. |
Jaar: |
2010 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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