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Journal description
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Details for article 811 of 4365 found articles
| Title: |
Characterization and evaluation of the underfill encapsulants for flip chip assembly |
| Author: | |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 36 (1996) nr. 4 pages 1 p. |
| Year: |
1996 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 811 of 4365 found articles
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