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                                       Details for article 269 of 4365 found articles
 
 
  Analysis of TAB inner lead fatigue in thermal cycle environments
 
 
Title: Analysis of TAB inner lead fatigue in thermal cycle environments
Author:
Appeared in: Microelectronics reliability
Paging: Volume 36 (1996) nr. 4 pages 1 p.
Year: 1996
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 269 of 4365 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands