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Journal description
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Details for article 3 of 31 found articles
| Title: |
AlN capping layer inserted between Cu and SiCN dielectric barrier layer for enhancing reliability of 28nm technological node and beyond |
| Author: |
Zhou, Ming |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 12PB pages 7 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 31 found articles
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