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Journal description
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Details for article 11 of 21 found articles
| Title: |
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability |
| Author: |
Tsai, M.Y. Huang, P.S. Lin, C.H. Wu, C.T. Hu, S.C. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 12PA pages 7 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 21 found articles
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