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Journal description
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Details for article 819 of 827 found articles
| Title: |
Void formation at the interface in Sn/Cu solder joints |
| Author: |
Yang, Yang Lu, Hao Yu, Chun Li, Yongzhi |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 12 pages 5 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 819 of 827 found articles
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