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Journal description
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Details for article 655 of 827 found articles
| Title: |
Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages |
| Author: |
Zhang, Liang Xue, Song-bai Gao, Li-li Sheng, Zhong Yu, Sheng-lin Chen, Yan Dai, Wei Ji, Feng Guang, Zeng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 50 (2010) nr. 12 pages 7 p. |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 655 of 827 found articles
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