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Details for article 634 of 3138 found articles
| Title: |
Computational modelling for reliable flip-chip packaging at sub-100μm pitch using isotropic conductive adhesives |
| Author: |
Stoyanov, S. Kay, R. Bailey, C. Desmulliez, M. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 47 (2007) nr. 1 pages 10 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 634 of 3138 found articles
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