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                                       Details for article 38 of 110 found articles
 
 
  Evaluation of the mechanical integrity of beam lead devices and bonds using thermomechanical stress waves
 
 
Title: Evaluation of the mechanical integrity of beam lead devices and bonds using thermomechanical stress waves
Author:
Appeared in: Microelectronics reliability
Paging: Volume 10 (1971) nr. 5 pages 1 p.
Year: 1971
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 38 of 110 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands