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                                       Details for article 58 of 71 found articles
 
 
  Response surface models for efficient, modular estimation of solder joint reliability in area array packages
 
 
Title: Response surface models for efficient, modular estimation of solder joint reliability in area array packages
Author: Zhang, L.
Subbarayan, G.
Hunter, B.C.
Rose, D.
Appeared in: Microelectronics reliability
Paging: Volume 45 (2005) nr. 3-4 pages 13 p.
Year: 2005
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 58 of 71 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands