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Journal description
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Details for article 18 of 71 found articles
| Title: |
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry |
| Author: |
Joo, Jinwon Cho, Seungmin Han, Bongtae |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 45 (2005) nr. 3-4 pages 10 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 71 found articles
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