|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 32 of 47 found articles
| Title: |
Residual compression in area array packages induced by underfill shrinkage |
| Author: |
Larson, Michael C. Verges, Melody A. Liu, Xia |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 46 (2006) nr. 2-4 pages 7 p. |
| Year: |
2006 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 32 of 47 found articles
| << previous | next >> |