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Journal description
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Details for article 78 of 87 found articles
| Title: |
Substrate-to-base solder joint reliability in high power IGBT modules |
| Author: |
Herr, E. Frey, T. Schlegel, R. Stuck, A. Zehringer, R. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 37 (1997) nr. 10-11 pages 4 p. |
| Year: |
1997 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 78 of 87 found articles
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