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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 4 of 23 found articles
| Title: |
Copper electromigration modeling including barrier layer effect |
| Author: |
Wu, W. Yuan, J.S. |
| Appeared in: |
Solid-state electronics |
| Paging: | Volume 45 (2001) nr. 12 pages 6 p. |
| Year: |
2001 |
| Contents: | |
| Publisher: |
Elsevier Science Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 23 found articles
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