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Journal description
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Details for article 29 of 31 found articles
| Title: |
The effect of tricyclazole as a novel leveler for filling electroplated copper microvias |
| Author: |
Liao, Chaohui Zhang, Shengtao Chen, Shijin Qiang, Yujie Liu, Gen Tang, Mingxing Tan, Bochuan Fu, Denglin Xu, Yue |
| Appeared in: |
Journal of electroanalytical chemistry |
| Paging: | Volume 827 (2018) nr. C pages 151-159 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 31 found articles
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