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                                       Details for article 254 of 339 found articles
 
 
  Primary particle and agglomerate size measurement in chemical mechanical polishing (CMP) slurry using electrospray technique
 
 
Title: Primary particle and agglomerate size measurement in chemical mechanical polishing (CMP) slurry using electrospray technique
Author: Yoo, Seong-Ho
Woo, Keung-Shan
Liu, Benjamin Y.H.
Appeared in: Journal of aerosol science
Paging: Volume 29 (1998) nr. S2 pages 2 p.
Year: 1998
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 254 of 339 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands