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  A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds
 
 
Title: A chevron specimen for the measurement of mixed-mode interface toughness of wafer bonds
Author: Tadepalli, R.
Turner, K.T.
Appeared in: Engineering fracture mechanics
Paging: Volume 75 (2008) nr. 6 pages 10 p.
Year: 2008
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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