|
| next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 1 of 9 found articles
| Title: |
Application of virtual crack closure integral method for interface cracks in low-k integrated circuit devices under thermal load |
| Author: |
Zhao, Jie-Hua |
| Appeared in: |
Engineering fracture mechanics |
| Paging: | Volume 72 (2005) nr. 9 pages 22 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 9 found articles
| next >> |